Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films

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Muhammad Mansoor Mansoor
Ahnaf Usman Zilohu
Muhammad Mujahid
Shaheed Khan

Abstract

Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. AuIn2). It was found that addition of silver (~3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature.

 

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How to Cite
Mansoor, M. M., Zilohu, A., Mujahid, M., & Khan, S. (2019). Wetting behavior and interfacial characteristic of eutectic In-Ag solders on Au thin films. Journal of Applied Research and Technology, 16(3). https://doi.org/10.22201/icat.16656423.2018.16.3.715
Author Biographies

Muhammad Mansoor Mansoor

Institute of Industrial Control Systems, Rawalpindi, PAKISTAN

Ahnaf Usman Zilohu

Institute of Industrial Control Systems, Rawalpindi, PAKISTAN

Muhammad Mujahid

School of Chemical and Materials Engineering, NUST, PAKISTAN

Shaheed Khan

Institute of Industrial Control Systems, Rawalpindi, PAKISTAN