Main Article Content
Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be implemented on FPGA, which could be incorporated to an automatic inspection system. The hardware implementation of the algorithm allows us to fulfill time requirements demanded by industry.
How to Cite
De Luca-Pennacchia, A., & Sánchez-MartínezM. Á. (2007). A FPGA implementation of solder paste deposit on printed circuit boards error detector based in a bright and contrast algorithm. Journal of Applied Research and Technology, 5(02). https://doi.org/10.22201/icat.16656423.2007.5.02.536