SKVORTSOV, A. A.; KORYACHKO, M. V.; SKVORTSOV, P. A.; LUK’YANOV, M. N. The problem of crack formation in thin sublayers of silicon oxide during pulsed heating of interconnects. Journal of Applied Research and Technology, [S. l.], v. 19, n. 2, p. 77–86, 2021. DOI: 10.22201/icat.24486736e.2021.19.2.1576. Disponível em: https://jart.icat.unam.mx/index.php/jart/article/view/1576. Acesso em: 4 may. 2024.