KAISER, M. S. Physical properties of Sn affected Cu through lead-free solder and combined effect of severe cold deformation and thermal ageing. Journal of Applied Research and Technology, [S. l.], v. 23, n. 1, p. 69–81, 2025. DOI: 10.22201/icat.24486736e.2025.23.1.2461. Disponível em: https://jart.icat.unam.mx/index.php/jart/article/view/2461. Acesso em: 2 apr. 2025.